Display device and manufacturing method of display device
AssigneeJapan Display Inc.
InventorArichika ISHIDA
Life of this patent
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Abstract
According to one embodiment, a display device includes an organic insulating layer, a lower electrode provided on the organic insulating layer, a planarization layer which is provided on the organic insulating layer and is in contact with a side surface of the lower electrode, an inorganic insulating layer which covers the planarization layer and covers a peripheral portion of the lower electrode, a partition having a lower portion and an upper portion, an organic layer surrounded by the partition, provided on the lower electrode and including a light emitting layer, and an upper electrode which is surrounded by the partition, is provided on the organic layer and is in contact with the lower portion of the partition.
Claims12
A display device comprising:
- a substrate;
- an organic insulating layer provided above the substrate;
- a lower electrode provided on the organic insulating layer;
- a planarization layer which is provided on the organic insulating layer and is in contact with a side surface of the lower electrode;
- an inorganic insulating layer which covers the planarization layer and covers a peripheral portion of the lower electrode;
- a partition having a lower portion which is provided on the inorganic insulating layer and is formed of a conductive material and an upper portion which is provided on the lower portion and protrudes from a side surface of the lower portion;
- an organic layer surrounded by the partition, provided on the lower electrode and including a light emitting layer;
- and
- an upper electrode which is surrounded by the partition, is provided on the organic layer and is in contact with the lower portion of the partition.
A manufacturing method of a display device, comprising:
- forming an organic insulating layer above a substrate;
- forming a lower electrode on the organic insulating layer;
- applying a positive photosensitive resin which covers the organic insulating layer and the lower electrode;
- forming a planarization layer which is in contact with a side surface of the lower electrode by patterning the photosensitive resin;
- forming an inorganic insulating layer which covers the planarization layer and covers a peripheral portion of the lower electrode;
- forming a partition having a lower portion which is located on the inorganic insulating layer and is formed of a conductive material and an upper portion which is located on the lower portion and protrudes from a side surface of the lower portion;
- forming an organic layer which is located on the lower electrode and includes a light emitting layer by vapor deposition using the partition as a mask;
- and
- forming an upper electrode which is located on the organic layer and is in contact with the lower portion of the partition by vapor deposition using the partition as a mask.
Dependencies are inferred from the claim text.