Boiler Enhancement Coatings with Active Boiling Management
AssigneeMTS IP Holdings Ltd
InventorsLuke Gregory, Jimil Shah, Ethan Schmitz, Richard Eiland
Life of this patent
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Abstract
Cooling assemblies and related methods to cool a plurality of semiconductor dies mounted to a printed circuit board are described. A valved boiling enhancement enclosure located adjacent to a heat spreader that thermally couples to one or more semiconductor dies. The boiling enhancement enclosure can actively manage boiling of coolant liquid near the heat spreader in a two-phase immersion-cooling chamber to make the temperatures across the semiconductor dies more uniform.
Claims30
A cooling assembly to cool a plurality of devices that produce heat, the cooling assembly comprising:
- a heat spreader extending across the plurality of devices and thermally coupled to the plurality of devices, wherein the plurality of devices are spaced apart and mounted to a printed circuit board;
- a casing enclosing, at least in part, a chamber located adjacent to the heat spreader;
- an exhaust port of the chamber having an opening passing through the casing to fluidically couple the chamber to an exterior region of the casing;
- and
- a valve arranged to close off the exhaust port, to retain gas within the chamber, and to open the exhaust port to vent the gas from the chamber into a coolant liquid surrounding the chamber when the cooling assembly is operating.
A cooling assembly to cool a plurality of devices that produce heat, the cooling assembly comprising:
- a heat spreader extending across the plurality of devices and thermally coupled to the plurality of devices, wherein the plurality of devices are spaced apart and mounted to a printed circuit board;
- a casing enclosing, at least in part, a chamber located adjacent to the heat spreader;
- an exhaust port of the chamber having an opening passing through the casing to fluidically couple the chamber to an exterior region of the casing;
- and
- a passive valve arranged to close off the exhaust port and to open the exhaust port.
A cooling assembly to cool a plurality of devices that produce heat, the cooling assembly comprising:
- a heat spreader extending across the plurality of devices and thermally coupled to the plurality of devices, wherein the plurality of devices are spaced apart and mounted to a printed circuit board;
- a casing enclosing, at least in part, a chamber located adjacent to the heat spreader;
- an exhaust port of the chamber having an opening passing through the casing to fluidically couple the chamber to an exterior region of the casing;
- and
- an active valve arranged to close off the exhaust port and to open the exhaust port, wherein the active valve comprises:
- an actuator;
- and
- a needle driven by the actuator to open and close the exhaust port.
A method of cooling a plurality of semiconductor dies in an immersion-cooling system, the method comprising:
- receiving heat from the plurality of semiconductor dies in a heat spreader;
- boiling coolant liquid in a chamber enclosed, at least in part, by a casing located adjacent to the heat spreader with heat provided from the heat spreader;
- and
- venting gas from the chamber through an exhaust port with a valve into coolant liquid outside the casing.
A two-phase immersion-cooling system comprising:
- a tank to contain a coolant liquid;
- a printed circuit board mounted within the tank and immersed in the coolant liquid;
- and
- a plurality of devices mounted on the printed circuit board and thermally coupled to a cooling assembly, the cooling assembly comprising:
- a heat spreader extending across the plurality of devices and thermally coupled to the plurality of devices;
- a casing enclosing, at least in part, a chamber located adjacent to the heat spreader;
- an exhaust port of the chamber having an opening passing through the casing to fluidically couple the chamber to an exterior region of the casing;
- and
- a valve arranged to close off the exhaust port and to open the exhaust port.
Dependencies are inferred from the claim text.