Switching board and soldering method thereof
AssigneeAewin Technologies Co., Ltd.
InventorsCheng-En LIU, Chun-Han CHEN, Hao-Yang HUANG, Yi-Tsang HSIAO, Jui-Chung LAI, Kai-Hsiang TSENG, Shih-Tsung CHEN
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Abstract
A switching board and a soldering method thereof are provided. The switching board includes a circuit board having a board body and a first metal ring, where the board body has a first surface, and the first metal ring is formed on the first surface and surrounds a periphery of the board body. The switching board further includes a first metal element disposed on the first surface and fastened to the first metal ring by soldering. The switching board has a high pressure resistance and a low leakage rate.
Claims17
A switching board disposed on a two-phase immersion cooling positive high pressure sealed tank, the switching board comprising:
- a circuit board having a board body and a first metal ring, wherein the board body has a first surface, and the first metal ring is formed on the first surface and surrounds a periphery of the board body;
- and
- a first metal element disposed on the first surface and fastened to the first metal ring by soldering.
A soldering method of a switching board, comprising:
- providing a circuit board and a first metal element, wherein the circuit board has a board body and a plurality of second metal rings, the board body has a first surface, and the plurality of second metal rings are formed on the first surface and spaced apart from one another;
- applying a first solder paste onto the plurality of second metal rings, and disposing and fastening the first metal element onto the first surface with a fastener to allow the first solder paste to be sandwiched between the first metal element and the circuit board;
- and
- feeding the circuit board and the first metal element fastened with the fastener into a baking unit, and performing baking at a temperature for a period of time.
Dependencies are inferred from the claim text.