Layered ceramic electronic component mounting structure

A mounting structure comprising a multilayer ceramic electronic component mounted on a circuit board, the multilayer ceramic electronic component including a multilayer body including a plurality of dielectric layers including ceramic material and a plurality of inner conductive layers stacked on each other, the multilayer body including two main surfaces on opposite sides in a thickness direction, two lateral surfaces on opposite sides in a width direction intersecting with the thickness direction, and two end surfaces on opposite sides in a length direction intersecting with both the thickness direction and the width direction;

• and
• first and second external electrodes spaced apart in the length direction, provided on only the two main surfaces of the multilayer body or only one of the two main surfaces of the multilayer body;
• wherein
• the circuit board includes a first land electrode and a second land electrode that are spaced apart in the length direction, and are respectively connected to the first external electrode and the second external electrode of the multilayer ceramic electronic component;
• an inner edge of the first external electrode on a second external electrode side in the length direction is located closer to the second external electrode side and a second land electrode side, than an inner edge of the first land electrode on the second land electrode side in the length direction;
• and
• an inner edge of the second external electrode on a first external electrode side in the length direction is located closer to the first external electrode side and a first land electrode side, than an inner edge of the second land electrode on the first land electrode side in the length direction.