Electrolytic capacitors having enclosures that enable the capacitors to be surface mounted to a substrate

A semiconductor package, comprising:

• a printed circuit board defining an opening;
• an electrolytic capacitor horizontally disposed within the opening and comprising a first lead and a second lead extending from a proximal end of the electrolytic capacitor;
• and
• an enclosure surrounding at least a distal end of the electrolytic capacitor and defining a support bar, wherein the first lead, the second lead and the support bar are soldered to respective solder pads provided on a surface of the printed circuit board.

A semiconductor package, comprising:

• a substrate defining an opening;
• a first connection means provided at a proximal side of the opening;
• a second connection means provided proximate to the first connection means;
• a third connection means provided at a distal side of the opening;
• an electrolytic capacitor horizontally disposed within the opening and comprising a first lead and a second lead;
• and
• a support means extending from an enclosure means associated with the electrolytic capacitor, wherein the first lead, the second lead and the support means are soldered to the first connection means, the second connection means and the third connection means respectively by a reflow soldering process.