Ultra-thin copper foil with carrier foil for allowing easy micro-hole processing, copper-clad laminate using same, and manufacturing method therefor
AssigneeLotte Energy Materials Corporation
InventorsChang Yol YANG, Won Jin BEOM, Kideok SONG, Hyung Cheol KIM
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Abstract
Disclosed is an ultra thin copper foil with a carrier foil and a manufacturing method therefor, wherein the ultra-thin copper foil with a carrier foil includes a carrier foil, a peeling layer, and an ultra-thin copper foil sequentially laminated, and the carrier foil includes a surface treatment layer on a face thereof facing the peeling layer.
Claims15
An ultra-thin copper foil with a carrier foil, in which a carrier foil, a peeling layer, and an ultra-thin copper foil are sequentially laminated,
- wherein the carrier foil comprises a surface treatment layer on a face thereof facing the peeling layer.
A method for manufacturing an ultra-thin copper foil with a carrier foil by comprising forming a lamination structure of a carrier foil, a peeling layer, and an ultra-thin copper foil,
- wherein the forming of the lamination structure comprises:
- providing the carrier foil;
- etching one surface of the carrier foil to form a surface treatment layer;
- and
- sequentially forming the peeling layer and the ultra-thin copper foil on the surface treatment layer.
Dependencies are inferred from the claim text.