Printed circuit board with enhanced structural support
AssigneeMicron Technology, Inc.
InventorsQuang Nguyen, Koustav Sinha, Christopher Glancey
Life of this patent
Estimating the term…
Abstract
Systems, apparatuses, and methods related to a printed circuit board (PCB) with a plurality of layers are described. Embodiments of the present technology can include low coefficient of thermal expansion (CTE) strips, such as material with a CTE value of less than a threshold level, added into the core layer of the PCB. The added low CTE strips can lower the overall CTE mismatch between the PCB and the mounted components.
Claims20
An electronic device comprising:
- a printed circuit board including a plurality of layers,
- wherein the plurality of layers includes at least one metal layer, and at least one core layer,
- wherein the at least one core layer includes core material and a coefficient of thermal expansion (CTE) adjustment structure extending along a first lateral direction and between the core material, and
- wherein the CTE adjustment structure includes a material different from the core material and configured to reduce an overall CTE of the printed circuit board;
- one or more components mounted on the printed circuit board.
A printed circuit board comprising:
- at least one metal layer;
- and
- at least one core layer attached to the at least one metal layer and including (1) core material and (2) at least one coefficient of thermal expansion (CTE) adjustment structure extending along a first lateral direction and between the core material,
- wherein the CTE adjustment structure includes a material different from the core material and configured to reduce an overall CTE of the printed circuit board, and
- wherein a length, a width, a location, or a combination thereof of the CTE adjustment structure is based on one or more planned locations for mounting components on the printed circuit board.
A method for controlling a coefficient of thermal expansion (CTE) of a printed circuit board, the method comprising:
- determining a set of dimensions for the printed circuit board;
- and
- determining an arrangement of core material and one or more CTE adjustment structures in a core layer, wherein the one or more CTE adjustment structures is adjacent to and coplanar with the core material,
- wherein the CTE adjustment structure includes material different from the core material and configured to reduce the CTE of the printed circuit board, and
- wherein determining the arrangement includes deriving a shape, a set of dimensions, and a position for each of the one or more CTE adjustment structures according to a targeted CTE for the printed circuit board or portions thereof.
Dependencies are inferred from the claim text.