Heat dissipating structure and electronic apparatus including heat dissipating structure

An electronic apparatus comprising:

• a printed circuit board;
• an electronic component disposed on the printed circuit board;
• a shield can disposed on the printed circuit board and comprising an opening facing at least a portion of the electronic component;
• a support structure disposed between the printed circuit board and the shield can and configured to support the shield can;
• a contact member at least partially located in the opening and configured to cover a portion of the electronic component;
• a sheet member comprising a first region which corresponds to the opening, and a second region other than the first region and configured to cover the contact member and the shield can;
• a first heat transfer member disposed on the sheet member;
• a second heat transfer member disposed on the sheet member and spaced apart from the first heat transfer member;
• and
• a cover member configured to cover the first heat transfer member and the second heat transfer member.