Acoustic wave devices

An acoustic wave device comprising:

• a device chip;
• a first metal pattern formed on one surface of the device chip and comprising a pattern configured to form a resonator;
• a second metal pattern formed on the one surface of the device chip so as to comprise a predetermined thickness larger than a thickness of the first metal pattern at any position and comprising a pattern comprising a signal input/output terminal, a wiring connecting the signal input/output terminal and the resonator, a wiring connecting a plurality of resonators comprising the resonator and a ground wiring;
• a first roof portion made of resin formed on the second metal pattern and cooperating with the one surface of the device chip and the second metal pattern to form a sealed space of the resonator;
• a metal layer within the roof formed on the first roof portion,
• a second roof portion made of resin formed on the first roof portion so as to position a portion of the metal layer within the roof between the first roof portion and the second roof portion,
• two or more heat dissipation solder bumps formed by using a heat dissipation passage hole passing through the second roof portion and including an inner end portion joined to the metal layer within the roof and an outer end portion protruding from the second roof portion.