Antenna modules and communication devices

An electronic assembly, comprising:

• a package substrate;
• a die having a first face and a second face opposite the first face;
• an antenna substrate, wherein the die is between the package substrate and the antenna substrate, and the first face of the die is closer to the package substrate than to the antenna substrate;
• a first antenna patch on the second face of the die;
• and
• a second antenna patch either in the antenna substrate or on a face of the antenna substrate, wherein a projection of the second antenna patch onto the package substrate at least partially overlaps with a projection of the first antenna patch onto the package substrate, and wherein there is no electrically continuously pathway that has one portion in conductive contact with the first antenna patch and another portion in conductive contact with the second antenna patch.

A communication device, comprising:

• a display;
• a back cover;
• and
• an antenna module between the display and the back cover, wherein the antenna module includes:
• an integrated circuit (IC) die,
• an antenna substrate over a face of die, and
• a stack of antenna patches,
• wherein the IC die includes circuitry to control operation of the stack of antenna patches, an antenna patch of the stack that is closest to the IC die is at the face of the IC die and is in contact with one or more electrically conductive material pathways of the IC die, and an antenna patch of the stack that is second closest to the IC die is on or in the antenna substrate and is electrically isolated from the antenna patch of the stack that is closest to the IC die.