Light-emitting diode packaging module

A light-emitting diode (LED) packaging module, comprising:

• a plurality of LED chips that are spaced apart from one another, each of said LED chips including
• a chip first surface as a light-exiting surface,
• a chip second surface opposite to said chip first surface,
• a chip side surface connecting said chip first surface and said chip second surface, and
• an electrode unit formed on said chip second surface;
• a wiring layer that is disposed on said chip second surfaces of said LED chips, and that has a first wiring layer surface adjacent to said LED chips, a second wiring layer surface opposite to said first wiring layer surface, and a side wiring layer surface connected between said first wiring layer surface and said second wiring layer surface, said wiring layer being divided into a plurality of wiring parts that are spaced apart from each other, said first wiring layer surface contacting and being electrically connected to said electrode units of said LED chips;
• and
• an encapsulant component that includes a first encapsulating layer covering said chip side surface and said chip first surface of each of said LED chips, and a second encapsulating layer covering said side wiring layer surface of said wiring layer and filling gaps among said wiring parts,
• wherein each of said LED chips has a thickness that is represented by TA, said first encapsulating layer has a thickness that is represented by TB, and TA and TB satisfy a relationship:
• TB/TA≥1.