Wiring substrate and method for manufacturing same, light-emitting panel, and display apparatus
AssigneesHefei BOE Ruisheng Technology Co., Ltd., Boe Technology Group Co., Ltd.
InventorHaifeng HU
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AssigneesHefei BOE Ruisheng Technology Co., Ltd., Boe Technology Group Co., Ltd.
InventorHaifeng HU
Estimating the term…
Provided in the embodiments of the present disclosure are a wiring substrate and a manufacturing method therefor, a light-emitting panel, and a display apparatus. The wiring substrate comprises: a substrate, a plurality of metal wires and an insulation layer, wherein the metal wires and the insulation layer are located on a same side of the substrate; the insulation layer is located in an area outside the metal wires and a part of the surfaces of the metal wires; the distance between the upper surface of the insulation layer and the substrate is greater than the distance between the upper surfaces of the metal wires and the substrate; the upper surface of the insulation layer can reflect light rays; the insulation layer is provided with first holes, and the first holes expose a part of the surfaces of the metal wires. By means of arranging the insulation layer, a function of protecting the metal wires can be achieved, so as to prevent the metal wires from being oxidized and corroded during a manufacturing process, and improve product performance. In addition, the surface of the insulation layer can reflect light rays, thus improving a light effect.
A wiring substrate, comprising:
A method for preparing a wiring substrate, comprising
A light-emitting panel, comprising:
Dependencies are inferred from the claim text.