Sintered compact substrate, light-emitting device, and methods for manufacturing sintered compact substrate and light-emitting device

A method for manufacturing a sintered compact substrate, the method comprising:

• providing a ceramic substrate having a first surface and a second surface opposite to the first surface, the ceramic substrate having a first arrangement portion recessed from a first planar portion of the first surface;
• disposing a first conductive paste containing a first metal powder in the first arrangement portion;
• obtaining a first conductor by firing the first conductive paste;
• forming a plurality of first recessed portions on a surface of the first conductor disposed in the first arrangement portion by polishing or grinding at least one of the first conductor or the ceramic substrate so that the first conductor and the first surface form a same plane;
• disposing a second conductive paste containing a second metal powder and a second organic resin binder in the plurality of first recessed portions;
• obtaining a second conductor by curing the second conductive paste;
• polishing or grinding the second conductor so that the second conductor and the first conductor form the same plane;
• and
• forming a first metal layer on surfaces of the first conductor and the polished or ground second conductor.