Light-emitting device and method for manufacturing the same

A light-emitting device, comprising:

• a circuit board;
• a connection board disposed on the circuit board;
• a first light-emitting element disposed on the connection board;
• a second light-emitting element adjacent to the first light-emitting element;
• a first isolation structure surrounding the first light-emitting element and the second light-emitting element and disposed between the first light-emitting element and the second light-emitting element;
• a light-converting layer disposed on the first light-emitting element and the second light-emitting element;
• and
• a second isolation structure surrounding the light-converting layer;
• wherein the first isolation structure comprises a reflective or scattering material, and the second isolation structure comprises a light-absorbing material.

A method for manufacturing a light-emitting device, comprising:

• forming a first light-emitting element and a second light-emitting element on a connection board;
• forming a first isolation structure between and around the first light-emitting element and the second light-emitting element;
• forming a light-converting layer on the first light-emitting element and the second light-emitting element;
• dicing the light-converting layer to form a plurality of light-converting segments that correspond to the first light-emitting element and the second light-emitting element;
• forming a second isolation structure between and around the light-converting segments;
• and
• connecting the connection board with a circuit board;
• wherein a thermal expansion coefficient of the connection board is less than a thermal expansion coefficient of the circuit board.