Lateral gate-all-around transistors, three-dimensional integrated circuit, and manufacturing method thereof
AssigneeBeijing Institute of Technology
InventorsShujun YE, Yeliang WANG
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AssigneeBeijing Institute of Technology
InventorsShujun YE, Yeliang WANG
Estimating the term…
Vertically superimposed lateral gate-all-around metal-oxide-semiconductor field-effect transistors are provided, a structure of a novel three-dimensional integrated circuit such as a CMOS logic circuit that is composed of the vertically superimposed lateral gate-all-around transistors, a random-access memory and the like, and a manufacturing method for the novel three-dimensional integrated circuit are provided. The manufacturing method for the vertically superimposed lateral gate-all-around transistors includes: first preparing a monolayer channel and a source/drain, then protected with a sacrificial layer; preparing an insulating isolation layer, preparing above repeated structures on the insulating isolation layer; preparing an insulating spacer layer between the source/drain and a gate of each of the layers, a gate oxide, a gate, and a source/drain electrode in a unified manner, and finally preparing a connecting wire connected to the outside. The novel three-dimensional integrated circuit can be implemented by connecting the lateral gate-all-around transistors by means of a wire.
A three-dimensional integrated circuit, wherein the three-dimensional integrated circuit has a structural feature that a plurality of layers of lateral gate-all-around metal-oxide-semiconductor field-effect transistors are superimposed and isolated by an insulating isolation layer in a direction perpendicular to a substrate;
A CMOS (Complementary Metal-Oxide-Semiconductor) logic device, comprising three lateral gate-all-around transistor units superimposed in a vertical direction,
A three-dimensional CMOS and non-logic gate, comprising two lateral gate-all-around transistor units superimposed in a vertical direction,
Dependencies are inferred from the claim text.