Semiconductor Device and Method of Forming MEMS Super-Junction Metal Oxide Semiconductor Using Vapor Phase Deposition
AssigneeIcemos Technology Ltd.
InventorsSamuel J. Anderson, Takeshi Ishiguro
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AssigneeIcemos Technology Ltd.
InventorsSamuel J. Anderson, Takeshi Ishiguro
Estimating the term…
A semiconductor device has a substrate and semiconductor layer formed over the substrate. The semiconductor layer has a first conductivity type. A trench is formed through the semiconductor layer. A semiconductor material having a second conductivity type is deposited over a side surface of the trench by vapor phase deposition or plasma doping. The semiconductor material is diffused into the semiconductor layer to form a first column of semiconductor material having the second conductivity type within the semiconductor layer. A first insulating layer is formed over the side surface of the trench. A body region is formed within the semiconductor layer. A source region is formed within the body region. A gate region is formed within the body region. A second insulating layer is formed over the trench. A third insulating layer is formed over the second insulating layer. A conductive layer is formed over the third insulating layer.
A method of making a semiconductor device, comprising:
A method of making a semiconductor device, comprising:
A semiconductor device, comprising:
A method of making a semiconductor device using atomic layer deposition, comprising:
Dependencies are inferred from the claim text.