Sensor package and a method for forming the same
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsBumRyul MAENG, MyungHo JUNG, HeeSoo LEE
Life of this patent
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Abstract
A method for forming a sensor package is disclosed. The method comprises: providing a sensor; forming an optical filter and a transparent mold on the sensor to form a sensor assembly; providing a substrate, wherein one or more connectors are attached on a front surface of the substrate; forming a first encapsulant layer on the front surface of the substrate, wherein the one or more connectors are exposed from the first encapsulant layer; disposing the sensor assembly on the first encapsulant layer; connecting the sensor with the one or more connectors; and forming a second encapsulant layer on the first encapsulant layer to cover the sensor assembly.
Claims13
A method for forming a sensor package, comprising:
- providing a sensor;
- forming an optical filter and a transparent mold on the sensor to form a sensor assembly;
- providing a substrate, wherein one or more connectors are attached on a front surface of the substrate;
- forming a first encapsulant layer on the front surface of the substrate, wherein the one or more connectors are exposed from the first encapsulant layer;
- disposing the sensor assembly on the first encapsulant layer;
- connecting the sensor with the one or more connectors;
- and
- forming a second encapsulant layer on the first encapsulant layer to cover the sensor assembly.
A sensor package, comprising:
- a substrate;
- one or more electronic components formed on the substrate;
- one or more connectors formed on the substrate;
- a first encapsulant layer for encapsulating the one or more electronic components and the one or more connectors, wherein the one or more connectors are exposed from a front surface of the first encapsulant layer;
- a sensor formed on the first encapsulant layer and electrically coupled to the one or more connectors, wherein the sensor is formed on the first encapsulant layer;
- an optical filter formed on the sensor;
- a transparent mold formed on the optical filter;
- and
- a second encapsulant layer encapsulating the sensor, the optical filter and the transparent mold.
Dependencies are inferred from the claim text.