High-density capacitor for focal plane arrays

A method of fabricating a unit cell of a focal plane array, the method comprising:

• providing an integrated circuit substrate including one or more integrated electrical components;
• depositing a proximal portion of a dielectric layer on the integrated circuit substrate;
• etching a plurality of recess structures into the proximal portion of the dielectric layer, wherein each of the plurality of recess structures defines a partial via formed in a first surface of the proximal portion of the dielectric layer and includes sidewalls that extend from the first surface to a bottom portion of the respective recess structure;
• forming a capacitor structure in the plurality of recess structures;
• depositing a distal portion of the dielectric layer on the capacitor structure and a region of the proximal portion of the dielectric layer;
• forming a plurality of vias passing through the distal portion of the dielectric layer to the capacitor structure;
• forming a metal layer on the distal portion of the dielectric layer, wherein the plurality of vias are positioned between the capacitor structure and the metal layer and electrically connect the capacitor structure to the metal layer;
• and
• forming a detector overlying the metal layer.