Thermally conductive spacer
AssigneeWestern Digital Technologies, Inc.
InventorsJayavel Pachamuthu, Niles Yang, Daniel J. Linnen, Kirubakaran Periyannan
Life of this patent
Estimating the term…
Abstract
A thermally conductive spacer is positioned between two semiconductor dies in a stack of semiconductor dies. The spacer includes thermal conductivity features that dissipate heat or otherwise conduct heat away from the semiconductor dies in the stack. The spacer may have dimensions that are larger than the dimensions of the semiconductor dies in the stack. The thermal conductivity features of the spacer, in addition to the larger dimensions, enable the spacer to effectively dissipate heat from, and improve a thermal profile of, the stack of semiconductor dies.
Claims20
A semiconductor package, comprising:
- a printed circuit board (PCB);
- a first stack of semiconductor dies;
- a second stack of semiconductor dies;
- and
- a thermally conductive spacer provided between the first stack of semiconductor dies and the second stack of semiconductor dies, the thermally conductive spacer comprising:
- a thermal conductivity feature that moves heat generated by the semiconductor dies adjacent to the thermally conductive spacer away from the adjacent semiconductor dies.
A semiconductor package, comprising:
- a printed circuit board (PCB);
- a stack of memory dies, each memory die of the stack of memory dies having a first set of dimensions;
- and
- a thermally conductive spacer provided between a first memory die of the stack of memory dies and a second memory die of the stack of memory dies, the thermally conductive spacer having a thermal conductivity feature and having a second set of dimensions that are larger than the first set of dimensions.
A semiconductor package, comprising:
- a first stack of integrated circuit means;
- a second stack of integrated circuit means;
- a thermally conductive spacing means provided between the first stack of integrated circuit means and the second stack of integrated circuit means, the thermally conductive spacing means comprising:
- a thermal conductivity means;
- and
- a set of dimensions that are greater than a set of dimensions of at least one integrated circuit means in the first stack of integrated circuit means.
Dependencies are inferred from the claim text.