Method and structure for a three-dimensional package

A method comprising:

• attaching a bridge die to a first die and a second die, the bridge die electrically coupling the first die to the second die, the bridge die having a first thickness;
• attaching a third die to the first die and a fourth die to the second die, the bridge die interposed between the third die and the fourth die, the third die having a second thickness, the fourth die having a third thickness, wherein each of the second thickness and the third thickness are between 5 times and 15 times the first thickness;
• depositing an encapsulant over the bridge die, the first die and the second die to laterally surround the third die, the fourth die, and the bridge die;
• and
• grinding an upper surface of the encapsulant and an upper portion of the third die and the fourth die until each of the second thickness and the third thickness are between 3 times and 10 times the first thickness.