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US 2024/0404985 A1Published application
Semiconductor chip bonding device
AssigneeSamsung Electronics Co., Ltd.
InventorBONGKEN YU
Life of this patent
Estimating the term…
Abstract
A semiconductor chip bonding device may include a substrate support, a bonding head moveable in a first direction toward the substrate support, and a sealing member disposed on the bonding head and surrounding a circumferential surface of the bonding head and extending in the first direction from the bonding head toward the substrate support and movable in the first direction.
Claims20
A semiconductor chip bonding device comprising:
- a substrate support;
- a bonding head moveable in a first direction toward the substrate support;
- and
- a sealing member disposed on the bonding head and surrounding a circumferential surface of the bonding head and extending in the first direction from the bonding head toward the substrate support and movable in the first direction.
1 more element
A semiconductor chip bonding device for bonding a semiconductor chip on a substrate, comprising:
- a substrate support supporting the substrate;
- a bonding head including a support plate supporting the semiconductor chip, and a first penetration hole disposed penetrating the support plate and securing the semiconductor chip;
- and
- a sealing member surrounding a circumferential surface of the support plate and extending in a first direction from the bonding head toward the substrate, and comprising a lower sealing member movable in the first direction independent of the bonding head.
1 more element
A semiconductor chip bonding device for bonding a semiconductor chip on a substrate, comprising:
- a substrate support supporting the substrate;
- a bonding head including a support plate supporting the semiconductor chip, and a first penetration hole disposed penetrating the support plate and securing the semiconductor chip;
- a sealing member completely surrounding a circumferential surface of the support plate and extending in a first direction from the support plate toward the substrate;
- and
- a protection layer disposed on at least a portion of a lower surface of the support plate and an inner surface of the sealing member,
- wherein the sealing member comprises an upper sealing member including a space accommodating an elasticity member and at least a portion of a lower sealing member extending in the first direction and movable in the first direction independent of the bonding head.
3 more elements
Dependencies are inferred from the claim text.