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US 2024/0404980 A1Published application
Bond wire having a recycled thermoplastic core with conductive fillers
AssigneeWestern Digital Technologies, Inc.
InventorsMUHAMAD RIDHWAN HAFIZ BIN ROSDI, CINDIRELLA QUINIT NOROMOR, DUNSOON TESICO, MUHAMMAD FAIZUL MOHD YUNUS
Life of this patent
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Abstract
A bond wire has an outer layer formed of a conductive material and a core formed of a non-conductive material. The non-conductive material is blended with conductive fillers to enhance electrical and/or thermal conductivity characteristics of the bond wire.
Claims20
A method for manufacturing a bond wire, comprising:
- providing a core material to a co-extrusion die of an extruder, the core material comprising a conductive filler material blended with a non-conductive material;
- providing a conductive material to the co-extrusion die of the extruder;
- causing the core material to form a core as the core material passes through the co-extrusion die during a co-extrusion process, the core having the conductive filler material;
- and
- causing the conductive material to form an outer layer on the core during the co-extrusion process to create the bond wire.
2 more elements
A bond wire, comprising:
- a core comprising:
- a non-conductive material;
- and
- a conductive filler blended with the non-conductive material;
- and
- an outer layer surrounding the core, the outer layer comprising a conductive material.
3 more elements
A bond wire for a semiconductor device, comprising:
- a core means, comprising:
- a non-conductive recycled material;
- and
- a conductive filler blended with the non-conductive recycled material, the core means comprising between approximately ten percent to approximately forty percent of the bond wire;
- and
- a coating means surrounding the core means, the coating means comprising a conductive material.
3 more elements
Dependencies are inferred from the claim text.