Upper conductive structure having multilayer stack to decrease fabrication costs and increase performance

An integrated chip, comprising:

• a dielectric structure overlying a semiconductor substrate;
• a conductive wire disposed within the dielectric structure, wherein a top surface of the conductive wire is aligned with a top surface of the dielectric structure;
• a passivation structure disposed over the dielectric structure and comprising opposing sidewalls defining a trench over the conductive wire;
• and
• an upper conductive structure disposed within the trench and electrically coupled to the conductive wire, wherein the upper conductive structure comprises a first conductive layer, a dielectric layer, and a second conductive layer, wherein the first conductive layer and the dielectric layer are disposed along a top surface of the passivation structure, wherein the second conductive layer lines the trench and directly contacts the top surface of the conductive wire, and wherein a top surface of the second conductive layer is above the dielectric layer.

A method for forming an integrated chip, the method comprising:

• depositing a passivation structure over a conductive wire;
• depositing a first conductive layer over the passivation structure;
• depositing a dielectric layer over the first conductive layer;
• performing a patterning process on the passivation structure, the first conductive layer, and the dielectric layer to form an opening above the conductive wire, wherein the patterning process forms a metal oxide along a top surface of the conductive wire;
• performing a cleaning process on the dielectric layer and the conductive wire to remove the metal oxide from along the top surface of the conductive wire;
• depositing a second conductive layer over the dielectric layer and the conductive wire such that the second conductive layer lines the opening and contacts the conductive wire;
• and
• etching the second conductive layer, the dielectric layer, and the first conductive layer to form an upper conductive structure over the conductive wire.