Semiconductor package and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTzuan-Horng Liu, Chih-Wei Wu
Life of this patent
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Abstract
A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first device die; a second device die, stacked on the first device die; and first electrical connectors and second electrical connectors, disposed in between the first and second device dies. A first pitch between the first electrical connectors is greater than a second pitch between the second electrical connectors. The first and second electrical connectors respectively comprise a solder joint and first metallic layers lying at opposite sides of the solder joint and formed of a first metallic material. Each of the second electrical connectors further comprises at least one second metallic layer formed of a second metallic material.
Claims20
A semiconductor package, comprising:
- a first device die;
- a second device die, stacked on the first device die;
- and
- first electrical connectors and second electrical connectors, disposed in between the first and second device dies, wherein a first pitch between the first electrical connectors is greater than a second pitch between the second electrical connectors, the first and second electrical connectors respectively comprise a solder joint and first metallic layers lying at opposite sides of the solder joint and formed of a first metallic material, and each of the second electrical connectors further comprises at least one second metallic layer formed of a second metallic material.
A semiconductor package, comprising:
- a first device die;
- a second device die, stacked on the first device die;
- a first polymer layer, disposed on a surface of the first device die;
- a second polymer layer, disposed on a surface of the second device die, and bonded with the first polymer layer;
- first electrical connectors and second electrical connectors, extending through the first and second polymer layers, wherein the first and second electrical connectors respectively comprise a solder joint and first metallic layers lying at opposite sides of the solder joint and formed of a first metallic material, and each of the second electrical connectors further comprises at least one second metallic layer formed of a second metallic material;
- a first encapsulant, disposed on the first device die, and laterally encapsulating the second device die;
- and
- a second encapsulant, laterally surrounding the first encapsulant and the first device die.
A semiconductor package, comprising:
- a first package component;
- a second package component, vertically spaced apart from the first package component;
- and
- first electrical connectors and second electrical connectors, disposed in between the first and second package components and connecting the first and second package components with each other, wherein a first critical width of each first electrical connector is greater than a second critical width of each second electrical connector, the first and second electrical connectors respectively comprise a solder joint and first metallic layers lying at opposite sides of the solder joint and formed of a first metallic material, and each of the second electrical connectors further comprises at least one second metallic layer formed of a second metallic material.
Dependencies are inferred from the claim text.