Semiconductor device including backside signal wiring and frontside power supply
AssigneeInternational Business Machines Corporation
InventorsRuilong Xie, Chanro Park, Juntao Li, Min Gyu Sung, Julien Frougier
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Abstract
A semiconductor device is provided including frontside interconnects (i.e., metal wires) used mainly as power supplies and backside interconnects (i.e., metal wires) used mainly as signal wiring. The semiconductor device includes a frontside back-end-of-the-line (BEOL) structure including frontside metal wires located in the frontside of the device, and a backside BEOL interconnect structure including backside metal wires located in a backside of the device. At least 90% of the frontside metal wires are power distribution metal wires and at least 90% of the backside metal wires are signal wires.
Claims20
A semiconductor device comprising:
- a transistor located in a frontside of the device, the transistor including a gate structure located adjacent to a pair of source/drain regions;
- a frontside BEOL structure comprising frontside metal wires located in the frontside of the device;
- and
- a backside BEOL interconnect structure comprising backside metal wires located in a backside of the device, wherein at least 90% of the frontside metal wires are power distribution metal wires and at least 90% of the backside metal wires are signal wires.
Dependencies are inferred from the claim text.