Frontside to backside connection within double diffusion break

Abstract

A semiconductor IC device includes a conductive through device connection. The connection may be located within a double diffusion break (DDB) region that separates active regions. The connection may include a faux S/D region between a frontside contact and a backside contact. The semiconductor IC device may further include a first and/or second diffusion break isolation rail. The connection may be between the first and second diffusion break isolation rails. The connection location within the DDB region may resultantly increase packing densities of the semiconductor IC device. Further, the connection may reduce routing complexities and resistance through the semiconductor IC device, which may improve semiconductor IC device performance. Further, the connection may utilize mirrored structure instances (e.g., frontside contact, backside contact, faux S/D region, or the like) as that are used by microdevices (e.g., transistors, or the like) within the active regions, which may decrease fabrication complexities.

Dependencies are inferred from the claim text.