Semiconductor device and package structure of semiconductor device

A package structure of a semiconductor device, comprising:

• a semiconductor device;
• and
• a substrate on which the semiconductor device is mounted,
• wherein the semiconductor device includes:
• a semiconductor element including a first electrode, a second electrode, and a third electrode, energization of the first electrode and the third electrode being controlled by voltage application to the second electrode;
• a first lead electrically connected to the first electrode;
• a second lead electrically connected to the second electrode;
• a third lead electrically connected to the third electrode;
• and
• a sealing resin covering at least the semiconductor element,
• wherein the substrate includes an insulating portion and a wiring portion,
• the wiring portion includes a first region electrically bonded to the first lead, a second region electrically bonded to the second lead, a third region electrically bonded to the third lead, a fourth region adjacent to the third region and electrically bonded to the third lead, a fifth region connected to a ground, a sixth region electrically interposed between the fourth region and the fifth region, and a main current terminal electrically connected to the third region, and
• an impedance of a path from the third lead to the fifth region via the fourth region and the sixth region is larger than an impedance of a path from the third lead to the main current terminal.