Electronic component with improved board level reliability
AssigneeMurata Manufacturing Co., Ltd.
InventorSami NURMI
Life of this patent
Estimating the term…
Abstract
A device may include a circuit board with a top side and a bottom side, wherein the circuit board defines a horizontal xy-plane and a vertical z-direction which is perpendicular to the horizontal xy-plane. A device may include a die attached to the top side of the circuit board, a top package, wherein the top package is attached to the top side of the circuit board and surrounds the die. A device may include a bottom package, wherein the bottom package is attached to the bottom side of the circuit board and a bottom surface of the bottom package forms the bottom side of the electronic component, wherein the bottom package includes a side wall having an outside surface, and wherein the outside surface comprises a metallic surface.
Claims15
An electronic component comprising:
- a circuit board with a top side and a bottom side, wherein the circuit board defines a horizontal xy-plane with a vertical z-direction being perpendicular to the horizontal xy-plane,
- a die attached to the top side of the circuit board,
- a top package attached to the top side of the circuit board and that surrounds the die;
- and
- a bottom package attached to the bottom side of the circuit board and having a bottom surface that forms the bottom side of the electronic component,
- wherein the bottom package includes a side wall having an outside surface that comprises a metallic surface.
A method for manufacturing an electronic component comprising:
- attaching a first set of dies to a top side of a horizontal circuit board in a first region;
- forming a top package on a top side of the horizontal circuit board around the first set of dies that are enclosed in the top package;
- attaching one or more vertical circuit boards to a bottom surface of the horizontal circuit board in a dicing region;
- forming a bottom package on a bottom side of the horizontal circuit board;
- and
- dicing the electronic component in the dicing region along a z-direction from a top surface of the top package to the bottom surface of the bottom package so that an inner metallic surface of one or more vias is exposed.
Dependencies are inferred from the claim text.