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US 2024/0404933 A1Published application
Metaconductor based coaxial type rf devices
OwnerYong Kyu Yoon, Saeyeong Jeoninventors
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Abstract
The present disclosure describes various embodiments of systems, apparatuses, and related methods for a coaxial through-substrate-via (cx-TSV) based on a Cu/Co metaconductor. One such apparatus comprises a substrate; and a coaxial structure having an outer conductor and a metaconductor for its inner conductor, wherein the coaxial structure extends through the substrate.
Claims20
A coaxial through-substrate via comprising:
- a substrate;
- and
- a coaxial structure having an outer conductor and a metaconductor for its inner conductor, wherein the coaxial structure extends through the substrate to form an antenna or an interconnecting wire,
- wherein the metaconductor consists of alternating layers of non-ferromagnetic materials and ferromagnetic materials.
1 more element
A method comprising:
- surrounding a first cylindrical metal conductor with a cylindrical dielectric layer, wherein the first cylindrical metal conductor comprises a superlattice of non-ferromagnetic materials and ferromagnetic materials in alternating layers to form a metaconductor;
- surrounding the cylindrical dielectric layer with a second cylindrical metal conductor to form a coaxial structure;
- extending the coaxial structure through a substrate to form an antenna or an interconnecting wire.
Dependencies are inferred from the claim text.