Electronic device with wafer level capacitor

A method comprising:

• attaching a die attach film on a non-active side of a die;
• attaching the non-active side of the die to a die pad of a leadframe;
• attaching a wire bond from an active side of the die to the die pad, wherein the active side is opposite of the non-active side;
• and
• forming a molding compound over the die, the wire bond, and a portion of the leadframe,
• wherein the formation of the die, the die attach film, and the die pad form a capacitor that filters noise from a signal from the die to the die pad via the wire bond.

An electronic device comprising:

• a leadframe having a die pad and leads;
• a die attached to the die pad, the die including an active side and a non-active side opposite that of the active side;
• a die attach film attached to the non-active side of the die that facilitates attachment of the die to the die pad;
• a wire bond attached from the active side of the die to the die pad;
• a mold compound encapsulating the die, the wire bond, and a portion of the leadframe,
• wherein a stacked formation of the die, the die attach film, and the die pad form a capacitor that filters noise from a signal carried by the wire bond.