Electronic device and method of manufacturing the same
AssigneeInnolux Corporation
InventorsKer-Yih KAO, Wei-Yuan CHENG, Ju-Li WANG
Life of this patent
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Abstract
An electronic device includes an electronic component including a chip and a protective layer disposed on the active surface of the chip; an encapsulation layer surrounding the electronic component; and a circuit structure contacting the first surface of the encapsulation layer and electrically connecting the electronic component. The protective layer has a second surface away from the active surface, and a first step difference between the first surface and the second surface is between 1 and 10 μm.
Claims20
An electronic device, comprising:
- an electronic component comprising a chip and a protective layer disposed on an active surface of the chip;
- an encapsulation layer surrounding the electronic component;
- and
- a circuit structure contacting a first surface of the encapsulation layer and electrically connecting the electronic component,
- wherein the protective layer has a second surface away from the active surface, and a first step between the first surface and the second surface is between 1-10μ m.
A method of manufacturing an electronic device, comprising:
- providing an encapsulation layer surrounding an electronic component;
- providing a first conductive layer and a first conductive component on the electronic component and the encapsulation layer;
- performing a first surface treatment process on the first conductive component;
- providing a first insulating layer on the first conductive component subjected to the first surface treatment process;
- performing a flattening process;
- and
- performing a second surface treatment process,
- wherein the electronic component comprises a chip and a protective layer covering an active surface of the chip, the protective layer has a second surface, the encapsulation layer has a first surface, the second surface and the first surface are separated by a first step difference, and the first step difference is between 1 and 10 μm.
A method of manufacturing an electronic device, comprising:
- providing an encapsulation layer surrounding at least two electronic components;
- providing a first conductive layer and a first conductive component on one of the electronic components and the encapsulation layer;
- performing a first surface treatment process on the first conductive component;
- providing a first insulating layer on the first conductive layer, the first conductive component, and the other electronic component;
- forming a third opening through the encapsulation layer between the at least two electronic components;
- forming a second conductive layer and a second conductive component on the other electronic component and in the third opening to electrically connect the at least two electronic components;
- providing a second insulating layer on the second conductive layer and the second conductive component;
- performing a flattening process;
- and
- performing a second surface treatment process,
- wherein the electronic component comprises a chip and a protective layer covering an active surface of the chip, the protective layer has a second surface, the encapsulation layer has a first surface, the second surface and the first surface are separated by a first step difference, and the first step difference is between 1 and 10 μm.
Dependencies are inferred from the claim text.