Semiconductor package having routable encapsulated conductive substrate and method

An electronic device, comprising:

• a first laminated layer comprising:
• a first conductive pattern comprising a surface finish material;
• conductive vias coupled to the first conductive pattern;
• and
• a first resin layer covering the first conductive pattern and the conductive vias and comprising a first resin layer top side and a first resin layer bottom side, wherein:
• the first conductive pattern is exposed from the first resin layer top side;
• portions of the first conductive pattern are devoid of the conductive vias;
• and
• the conductive vias are exposed from the first resin layer bottom side;
• a second laminated layer adjacent to the first laminated layer and comprising:
• a second conductive pattern coupled to the conductive vias;
• conductive pads coupled to the second conductive pattern;
• and
• a second resin layer covering at least a portion of the first resin layer, the second conductive pattern, and the conductive pads, wherein:
• the second resin layer comprises a second resin layer top side and a second resin layer bottom side;
• and
• the conductive pads are exposed from the second resin layer bottom side;
• an electronic component coupled to the first conductive pattern;
• and
• an encapsulant encapsulating at least a portion of the first laminated layer and the semiconductor component.