Electronic device and manufacturing method thereof

Abstract

An electronic device is provided. The electronic device includes a chip, a protective layer, an encapsulation layer, and a circuit structure. The chip includes a base layer and at least one pad. The at least one pad is disposed on a first side of the base layer. The protective layer is disposed on the first side and has at least one opening. The at least one opening exposes a portion of the at least one pad. The encapsulation layer surrounds the chip and the protective layer. The circuit structure is disposed on the encapsulation layer and is electrically connected to the chip. The at least one pad has a concave surface. A portion of the circuit structure contacts the concave surface. A manufacturing method of the electronic device is also provided.

Dependencies are inferred from the claim text.