US 2024/0404892 A1 · METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE

Abstract

Acquired in a data acquisition process is a test result of an electrical test performed on a plurality of semiconductor chips. The test result is associated with arrangement information of the plurality of semiconductor chips. In a cutting process, a semiconductor wafer is cut based on a base point set in the semiconductor wafer. Identified in an identification process is a non-defective semiconductor chip or a defective semiconductor chip in a semiconductor wafer on which cutting processing has been performed based on appearance information of the semiconductor wafer on which the cutting processing has been performed and the test result of the semiconductor wafer before the cutting processing. The semiconductor wafer on which the cutting processing has been performed includes two or more semiconductor chips. The appearance information is an image of a region including the base point.

Claims17

Dependent claims

A method of manufacturing a semiconductor device, comprising:

a data acquisition step of acquiring a test result of an electrical test performed on a plurality of semiconductor chips formed in a semiconductor wafer to be associated with arrangement information of the plurality of semiconductor chips;
a cutting step of cutting the semiconductor wafer based on a base point set in the semiconductor wafer to form a semiconductor wafer on which cutting processing has been performed;
and
an identification step of identifying at least one of a non-defective semiconductor chip and a defective semiconductor chip in the semiconductor wafer on which the cutting processing has been performed based on appearance information of the semiconductor wafer on which the cutting processing has been performed and the test result of the semiconductor wafer before the cutting processing, wherein
the semiconductor wafer on which the cutting processing has been performed includes two or more semiconductor chips, and
the appearance information is an image of a region including the base point.

3 more elements

A semiconductor manufacturing device, comprising:

a data acquisition circuitry acquiring a test result of an electrical test performed on a plurality of semiconductor chips formed in a semiconductor wafer to be associated with arrangement information of the plurality of semiconductor chips;
a cutting part cutting the semiconductor wafer based on a base point set in the semiconductor wafer to form a semiconductor wafer on which cutting processing has been performed;
and
an identification circuitry identifying at least one of a non-defective semiconductor chip and a defective semiconductor chip in the semiconductor wafer on which the cutting processing has been performed based on appearance information of the semiconductor wafer on which the cutting processing has been performed and the test result of the semiconductor wafer before the cutting processing, wherein
the semiconductor wafer on which the cutting processing has been performed includes two or more semiconductor chips, and
the appearance information is an image of a region including the base point.

3 more elements

Dependencies are inferred from the claim text.

Method of manufacturing semiconductor device and semiconductor manufacturing device

Life of this patent

Method of manufacturing semiconductor device and semiconductor manufacturing device

Life of this patent

Abstract

Claims17