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US 2024/0404883 A1Published application
Silicon carbide chip, semiconductor device and method for manufacturing a silicon carbide chip
AssigneeInfineon Technologies AG
InventorsFranz-Josef Pichler, Fong Lim, Marko Omazic, Wee Khim Teng, Adbul Rahman Mohamed
Life of this patent
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Abstract
A silicon carbide chip includes a first main surface, a second main surface, and a side face. An angle α between the side face and a horizontal plane measured in the silicon carbide material is more than 78°, the angle α being measured in a region adjacent to the second main surface. Also described is a method for manufacturing the silicon carbide chip.
Claims16
A silicon carbide chip, comprising:
- a first main surface;
- a second main surface;
- and
- a side face,
- wherein an angle α between the side face and a horizontal plane measured in the silicon carbide material is more than 78°, the angle α being measured in a region adjacent to the second main surface.
2 more elements
A silicon carbide chip, comprising:
- a first main surface;
- a second main surface;
- a side face;
- and
- a layer of an intermetallic compound adjacent to the side face,
- wherein the layer of the intermetallic compound has a thickness of less than 2 μm in a region at a distance of less than 20 μm to the second main surface, the thickness being measured in a direction parallel to the first main surface.
3 more elements
A silicon carbide chip, comprising:
- a first main surface;
- a second main surface;
- and
- a side face,
- wherein a radius of curvature of an intersection between the second main surface and the side face is more than 0.5 μm.
2 more elements
A method for manufacturing a silicon carbide chip, the method comprising:
- defining a dicing kerf in a first main surface of a workpiece;
- increasing a depth of the dicing kerf to obtain an opening;
- further increasing the depth of the opening to a position less than 20% of a thickness of the workpiece relative to a second main surface of the workpiece;
- performing an annealing process to increase a width of the dicing kerf;
- and
- further increasing the depth of the opening to singulate the workpiece into silicon carbide chips.
3 more elements
Dependencies are inferred from the claim text.