Apparatus including a bonding head and a method of using the same

An apparatus, comprising:

• a first bonding head comprising;
• a first bonding head body;
• a first die chuck body coupled to the first bonding head body and having a first proximal side and a first distal side, wherein the first bonding head body is closer to the first proximal side than to the first distal side;
• a first land closer to the first distal side than to the first proximal side;
• a second land closer to the first distal side than to the first proximal side, wherein:
• the second land is spaced apart from and laterally surrounded by the first land,
• a first zone is disposed between the first land and the second land, and
• a second zone is laterally surrounded by the second land;
• a first pressure actuator configured to provide a first vacuum within the first zone, wherein the first vacuum is sufficient to hold a first die;
• and
• a second pressure actuator configured to provide a first pressure to the second zone, wherein the first pressure is sufficient to bow the first die while the first die is being held by the first vacuum within the first zone;
• a second bonding head comprising:
• a second bonding head body;
• a second die chuck body coupled to the second bonding head body and having a second proximal side and a second distal side, wherein the second bonding head body is closer to the second proximal side than to the second distal side;
• a third land closer to the second distal side than to the second proximal side;
• a fourth land closer to the second distal side than to the second proximal side, wherein:
• the fourth land is spaced apart from and laterally surrounded by the third land,
• a third zone is disposed between the third land and the fourth land, and
• a fourth zone is disposed laterally surrounded by the fourth land;
• a third pressure actuator configured to provide a second vacuum within the third zone, wherein the second vacuum is sufficient to hold a second die;
• and
• a fourth pressure actuator configured to provide a second pressure to the fourth zone, wherein the second pressure is sufficient to bow the second die while the second die is being held by the second vacuum within the third zone;
• and
• a controller configured such that the first bonding head can bond the first die to a destination substrate and the second bonding head can bond the second die to the destination substrate during a same point in time.

A method, comprising:

• holding a die with a bonding head, wherein the bonding head comprises:
• a bonding head body;
• a die chuck body coupled to the bonding head body and having a proximal side and a distal side, wherein the bonding head body is closer to the proximal side than to the distal side;
• a first land closer to the distal side than to the proximal side;
• a second land closer to the distal side than to the proximal side, wherein:
• the second land is spaced apart from and laterally surrounded by the first land,
• a first zone is disposed between the first land and the second land, and
• a second zone is laterally surrounded by the second land;
• a first pressure actuator configured to provide a first vacuum within the first zone, wherein the first vacuum is sufficient to hold the die;
• and
• a second pressure actuator configured to provide a pressure to the second zone, wherein the pressure is sufficient to bow the die while the die is being held by the first vacuum within the first zone;
• and
• bowing the die while the die is being held by the bonding head.