Wet cleaning method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsu Tung Yen, Chen-Chieh Chiang, Ling-Sung Wang, Che-Li Lin, Bo Hsiang Huang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsu Tung Yen, Chen-Chieh Chiang, Ling-Sung Wang, Che-Li Lin, Bo Hsiang Huang
Estimating the term…
A method includes: placing a semiconductor wafer in a chamber during a semiconductor fabrication process; providing a semiconductor cleaning apparatus, the semiconductor cleaning apparatus comprising: a first inlet configured to receive a carrier gas; a gas passageway connected to the first inlet; a second inlet configured to receive one or more fluids; and a fluid passageway connected to the second inlet; delivering the carrier gas from the first inlet to the at least one gas passage branch through the gas passageway; spraying the carrier gas onto the semiconductor wafer; delivering the one or more fluids from the second inlet to the at least one fluid passage branch through the fluid passageway; and spraying the one or more fluids onto the semiconductor wafer.
A method for cleaning a semiconductor device, the method comprising:
A method, comprising:
A method, comprising:
Dependencies are inferred from the claim text.