Ramped Spin-Dry on Semiconductor Wafer
AssigneeTexas Instruments Incorporated
InventorsChristopher Volk, Kenneth Bogedahl
Life of this patent
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Abstract
Methods and apparatus for forming an integrated circuit device, including performing a spin-cleaning step at a first rotational speed on a semiconductor substrate supporting the integrated circuit device at an intermediate stage of manufacturing. A rinse fluid is then dispensed over a top surface of the substrate. A rotational speed of the substrate is increased with a constant acceleration no greater than 125 revolutions per minute per second (rpm/s) from the first rotational speed to a second rotational speed. The second rotational speed is maintained for a rinse fluid extraction period. The rotational speed is then reduced to zero.
Claims20
A method of forming an integrated circuit (IC), comprising:
- performing a spin-cleaning step at a first rotational speed on a semiconductor substrate supporting the IC at an intermediate stage of manufacturing;
- then dispensing a rinse fluid over a top surface of the substrate;
- increasing a rotational speed of the substrate with a constant acceleration no greater than 125 revolutions per minute per second (rpm/s) from the first rotational speed to a second rotational speed;
- maintaining the second rotational speed for a rinse fluid extraction period;
- and
- then reducing the rotational speed to zero.
A method of forming an integrated circuit (IC), comprising:
- performing a fluid-based process on a semiconductor wafer including the IC at an intermediate stage of manufacturing, the fluid-based process including rotating the wafer at a first rotational speed;
- dispensing a rinse fluid onto the wafer after the fluid-based process;
- and
- then increasing rotational speed of the wafer with a constant acceleration to a second rotational speed over an acceleration period no less than five seconds.
A system, comprising:
- a motor operable for rotating a wafer, wherein the wafer comprises a plurality of partially formed integrated circuit (IC) devices each having a plurality of via openings;
- a nozzle operable for dispensing a rinse fluid onto the wafer;
- and
- a processing system operable for controlling rotation of the wafer via operation of the motor, including while:
- rinsing the wafer with the rinse fluid while rotating the wafer at a first speed;
- and
- cleaning the wafer by increasing the wafer rotation to a second speed utilizing a constant acceleration that is no greater than 125 revolutions per minute per second.
Dependencies are inferred from the claim text.