Factory interface vacuum generation using vacuum ejectors

A system operable for transporting semiconductor substrates, comprising:

• a factory interface;
• one or more robots disposed within the factory interface;
• and
• a vacuum ejector operable to provide vacuum to the factory interface.

A system operable for transporting substrates, comprising:

• a factory interface (FI) having one or more load ports;
• a first robot disposed within the FI;
• a sensor operable to generate a signal based on a condition associated with the FI;
• a vacuum ejector operable to provide vacuum to the FI;
• a source of clean dry air (CDA);
• a CDA regulator operable to control a flow of the CDA from the source to the vacuum ejector;
• a load lock;
• a first door operable to open and close, wherein an interior of the load lock and the interior of the FI are in fluidic communication while the first door is open, and wherein the interior of the load lock is fluidically isolated from the interior of the FI while the first door is closed;
• a vacuum pump operable to remove gas from the interior of the load lock, wherein the interior of the FI is fluidically isolated from the vacuum pump while the first door is closed;
• a transfer chamber;
• a second robot disposed within the transfer chamber;
• one or more processing chambers;
• and
• a controller configured to:
• cause the first robot to receive a carrier with a substrate thereon from one of the load ports;
• cause the vacuum ejector to provide vacuum to the FI after the first robot receives the carrier with the substrate;
• cause the first door to open after the vacuum ejector provides vacuum to the FI;
• cause the first robot to place the carrier with the substrate into the load lock while the first door is open;
• cause the first door to close after the first robot places the carrier with the substrate into the load lock;
• and
• cause the vacuum pump to remove gas from the load lock after the first door closes.