Method for producing vertical power transistors and vertical power transistor

A method for producing vertical power transistors having at least first trenches having a first trench depth and at least second trenches having a second trench depth, wherein the first trenches and the second trenches are arranged alternately laterally at a distance from one another, and the first trench depth and the second trench depth have a difference of at least 30%, the method comprising the following steps:

• applying a dielectric layer to a semiconductor material;
• applying a first photoresist layer to the dielectric layer;
• creating first openings having a first width in the first photoresist layer using first photolithography, wherein first regions of the dielectric layer are exposed by the first openings;
• etching the first regions of the dielectric layer to at least a specified depth of the dielectric layer such that a first structured dielectric layer is created;
• removing the first photoresist layer;
• applying a second photoresist layer to the first structured dielectric layer;
• creating second openings having a second width in the second photoresist layer using second photolithography, wherein second regions of the dielectric layer are exposed by the second openings;
• etching the second regions of the dielectric layer up to a surface of the semiconductor material such that a second structured dielectric layer is created;
• removing the second photoresist layer;
• and
• creating the first trenches and the second trenches starting from the second structured dielectric layer into the semiconductor material using a further etching step.

A method for producing vertical power transistors having at least first trenches having a first trench depth and at least second trenches having a second trench depth, wherein the first trench depth and the second trench depth have a difference of at least 30%, the method comprising the following steps:

• applying a dielectric layer to a semiconductor material;
• applying a photoresist layer to the dielectric layer;
• creating first openings having a first width and second openings having a second width in the photoresist layer using photolithography, wherein the first openings and the second openings are arranged alternately laterally at a distance from one another, wherein the first width and the second width are different in size, and the first openings expose first regions of the dielectric layer and the second openings expose second regions of the dielectric layer;
• etching the first regions and the second regions of the dielectric layer such that a structured dielectric layer is created;
• and
• creating the first trenches and the second trenches starting from the structured dielectric layer into the semiconductor material using a further etching step.