Electronic device and manufacturing method thereof
AssigneeInnolux Corporation
InventorsKer-Yih KAO, Zheng-Wei WU, Ju-Li WANG
Life of this patent
Estimating the term…
Abstract
An electronic device includes a chip, a protection, a molding layer and a redistribution structure layer. The chip has an active surface and a first side surface connected to the active surface. The protection layer is disposed on the active surface of the chip and has a second side surface. The molding layer surrounds the chip and the protection layer. The redistribution structure layer is disposed on the molding layer, on the protection layer and electrically connected to the chip. The roughness of the first side surface is different from the roughness of the second side surface.
Claims20
A method of manufacturing an electronic device, comprising:
- providing a substrate layer;
- providing a circuit structure on one side of the substrate layer;
- providing a protection layer on the circuit structure;
- performing a first cutting step to cut the protection layer to expose a portion of the substrate layer;
- and
- performing a second cutting step to cut the substrate layer to form a plurality of chips,
- wherein the first cutting step is different from the second cutting step.
An electronic device, comprising:
- a chip having an active surface and a first side surface connected to the active surface;
- a protection layer disposed on the active surface of the chip and having a second side surface;
- a molding layer surrounding the chip and the protection layer, wherein at least a portion of the second side surface is in contact with the molding layer;
- and
- a redistribution structure layer disposed on the molding layer and on the protection layer, and electrically connected to the chip, wherein, a roughness of the first side surface is different from a roughness of the second side surface.
Dependencies are inferred from the claim text.