Workpiece Processing Apparatus and Methods for the Treatment of Workpieces
AssigneesBeijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
InventorsTing Xie, Jiaying Yang, Haichun Yang
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Abstract
Systems and methods for thermal treatment of a workpiece are provided. In one example, a method for conducting a treatment process on a workpiece, such as a thermal treatment process, an annealing treatment process, an oxidizing treatment process, or a reducing treatment process in a processing apparatus is provided. The processing apparatus includes a plasma chamber and a processing chamber. The plasma chamber and the processing chamber are separated by a plurality of separation grids or grid plates. The separation grids or grid plates operable to filter ions generated in the plasma chamber. The processing chamber has a workpiece support operable to support a workpiece.
Claims19
A processing apparatus for processing a workpiece comprising:
- a processing chamber;
- a plasma chamber separated from the processing chamber;
- a gas delivery system configured to deliver one or more process gases to the plasma chamber;
- a plasma source configured to generate a plurality of radicals in a plasma from the one or more process gases in the plasma chamber;
- a workpiece support disposed within the processing chamber, the workpiece support configured to support a workpiece;
- and
- a focus ring configured to direct the plurality of radicals towards the workpiece.
Dependencies are inferred from the claim text.