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US 2024/0404749 A1Published application
Techniques for patterning ferrite materials
AssigneeMetamagnetics, Inc.
InventorsAlexander Sokolov, Ronald Harish Chand, Jacob G. Remz
Life of this patent
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Abstract
Systems, methods, and techniques for patterning an assembly having a ferrite layer and a substrate using a blade or LASER beam to make cuts in the ferrite layer to form active regions of the ferrite layer and inactive regions of the ferrite layer. The cuts may be configured to relieve strain in the ferrite lattice structure. The cuts may be configured to achieve desired RF operating characteristic for the ferrite layer.
Claims30
A method, comprising:
- receiving a pattern for an assembly having a ferrite layer and a dielectric layer;
- and
- mechanically or optically making cuts in the ferrite layer to form active regions of the ferrite layer and inactive regions of the ferrite layer.
A system, comprising:
- a memory storing instructions;
- and
- one or more processors that, when executing the instructions, are configured to:
- receive a pattern for an assembly having a ferrite layer and a dielectric layer;
- and
- mechanically or optically make cuts in the ferrite layer to form active regions of the ferrite layer and inactive regions of the ferrite layer.
3 more elements
Dependencies are inferred from the claim text.