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AssigneeHitachi High-Tech Corporation
InventorsMasanori OUCHI, Shinichi SHINODA, Yasutaka TOYODA, Ryou YUMIBA, Hiroyuki SHINDO
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The purpose of the present invention is to provide a computer program for achieving die-to-database inspection at high speed and with few false reports, and a semiconductor inspection device using the same. To achieve this purpose, the present invention proposes: a computer program comprising an encoder layer that is configured to determine the features of a design data image, and a decoder layer that is configured to generate, on the basis of a variation in an image (inspection target image) obtained by photographing an inspection target pattern, a statistic pertaining to the brightness values of pixels from feature values output by the encoder layer, wherein die-to-database inspection with few false reports can be achieved by comparing the inspection target image and the statistic obtained from the decoder layer and pertaining to the brightness values, and thereby detecting a defect region in the image; and a semiconductor inspection device using the same.
An image processing program for performing an inspection on a sample by using reference data of the sample and input data pertaining to the sample, which is stored in a storage medium the image processing program causing a processor to implement:
An image processing device for performing an inspection on a sample by using reference data of the sample and input data pertaining to the sample, the image processing device comprising:
An image processing method for performing an inspection on a sample by using reference data of the sample and input data pertaining to the sample, the image processing method comprising steps of:
A defect detection system for detecting a defect of a sample by using design data of the sample and input data which is related inspection, the defect detection system comprising:
Dependencies are inferred from the claim text.