Test system and test method to wafers
AssigneeNanya Technology Corporation
InventorChia-Lin TSAI
Life of this patent
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Abstract
A test system is provided, including an assessment subsystem, a neural network subsystem and a process control processor. The assessment subsystem receives a test image of a tested wafer from a probe apparatus. The process control processor controls, in response to the probe apparatus obtaining the test image, the assessment subsystem to perform an assessment operation to transmit the test image to the neural network subsystem in an automation mode. The neural network subsystem identifies an image specification of probe marks in the test image and generates an analyzed data of the test image to the assessment subsystem. The assessment subsystem further generates a first probe mark inspection result based on the analyzed data to the process control processor for generating a test result.
Claims20
A test system, comprising:
- an assessment subsystem configured to receive a test image of a tested wafer from a probe apparatus;
- a neural network subsystem;
- and
- a process control processor configured to control, in response to the probe apparatus obtaining the test image, the assessment subsystem to perform an assessment operation to transmit the test image to the neural network subsystem in an automation mode,
- wherein the neural network subsystem is configured to identify an image specification of probe marks in the test image and to generate an analyzed data of the test image to the assessment subsystem,
- wherein the assessment subsystem is further configured to generate a first probe mark inspection result based on the analyzed data to the process control processor for generating a test result.
A test method, comprising:
- obtaining, by a probe apparatus, a plurality of test images of a lot of wafers;
- marking, by a neural network subsystem, the plurality of test images based on a corresponding image specification of probe marks in each the plurality of test images to generate a plurality of marked images in a plurality of analyzed data;
- comparing, by an assessment subsystem, the plurality of test images and the plurality of marked images to generate a comparison result for each of the wafers in the lot;
- in response to the comparison, generating a first probe mark inspection result;
- and
- updating a record, corresponding to the lot of wafers, in a process control processor according to the first probe mark inspection result.
Dependencies are inferred from the claim text.