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US 2024/0403680 A1Published application
Majorana-based qubits in 3d topological insulator flakes
AssigneeMicrosoft Technology Licensing, LLC
InventorsDmitry PIKULIN, Roman LUTCHYN
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Abstract
Embodiments of the present disclosure includes qubit architectures and qubit elements of a quantum processor. A superconductor region overlaps a three-dimensional topological insulator layer. A vortex region extends through the superconductor region to the three-dimensional topological insulator layer. A peripheral portion of the vortex region is located on an edge of the superconductor region.
Claims20
A quantum processor, comprising:
- a three-dimensional topological insulator layer;
- a superconductor region disposed on the three-dimensional topological insulator layer;
- and
- a vortex region extending through the superconductor region to the three-dimensional topological insulator layer and having a peripheral portion located on an edge of the superconductor region.
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A qubit architecture, comprising:
- a three-dimensional topological insulator layer;
- a first superconductor region on the three-dimensional topological insulator layer;
- a first plurality of vortex regions extending through the first superconductor region to the three-dimensional topological insulator layer;
- and
- a first plurality of peripheral portions of the first plurality of vortex regions located at a first edge of the first superconductor region.
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Dependencies are inferred from the claim text.