Design automation methods for 3d integrated circuits and devices

A method of designing a 3D Integrated Circuit, the method comprising:

• partitioning at least one design into at least two levels, a first level and a second level,
• wherein said first level comprises a plurality of first transistors,
• wherein said second level comprises a plurality of second transistors, and
• wherein said second level is disposed on top of said first level;
• wherein said 3D Integrated Circuit comprises levels connection pads disposed between said first level and said second level;
• providing placement of said levels connection pads;
• performing a placement of said first level using a placer program executed by a computer,
• wherein said placement of said first level is based on said placement of said levels connection pads,
• wherein said placer is part of a Computer Aided Design (CAD) tool, and
• wherein said first level comprises first routing layers;
• and
• performing a routing of said first level by routing layers using a router executed by a computer,
• wherein said router is a part of the Computer Aided Design (CAD) tool or a part of another CAD tool, and
• wherein at least 30% of second level area comprises a repeating structure.

A method of designing a 3D Integrated Circuit, the method comprising:

• partitioning at least one design into at least two levels, a first level and a second level,
• wherein said first level comprises a plurality of first transistors,
• wherein said second level comprises a plurality of second transistors, and
• wherein said second level is disposed on top of said first level;
• wherein said 3D Integrated Circuit comprises levels connection pads disposed between said first level and said second level;
• providing placement of said levels connection pads;
• performing a placement of said first level using a placer program executed by a computer,
• wherein said placement of said first level is based on said placement of said levels connection pads,
• wherein said placer is part of a Computer Aided Design (CAD) tool, and
• wherein said first level comprises first routing layers;
• and
• performing a routing of said first level by routing layers using a router executed by a computer,
• wherein said router is a part of the Computer Aided Design (CAD) tool or a part of another CAD tool, and
• wherein said first level is designed to be processed with a different process node than a process node used for said second level.