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US 2024/0403494 A1Published application
Multi-Project Chip, Methods of Making, and Using the Same
AssigneeNEOWINE Co., Ltd.
InventorsHyo Seung LEE, Seen Suk KANG, Youngtack SHIM, Tae Wook KIM
Life of this patent
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Abstract
This invention is about a multi-project chip or MP-chip that includes multiple individual units that can be selectively driven by multiple orders, and one or more common units that can be driven by two or more of the orders, respectively. In particular, the MP-chip may be installed inside the MP-chip or may be manufactured as a body separate the MP-chip or installed inside the MP-chip.
Claims10
A multi-project chip, the multi-project chip comprising:
- a first individual unit including at least one of a first hardware element and a first software element;
- a second individual unit including at least one of a second hardware element and a second software element;
- a common unit including at least one of the third hardware element and the third software element;
- a first security element configured to receive a first signal for driving a first individual unit;
- a second security element configured to receive a second signal for driving the second individual unit;
- wherein the first security element allows the first individual unit to drive together with the common unit to execute the first operation upon receiving the first signal,
- wherein the second security element allows the second individual unit to drivee
- together with the common unit to execute a second operation upon receiving the second signal.
5 more elements
Dependencies are inferred from the claim text.