Systems and methods for semiconductor devices with extended high-bandwidth memory (hbm) offsets

An apparatus comprising:

• a circuit comprising a first connector and a second connector, the circuit being configured to send a first signal using the first connector to indicate a first selection, the second connector being positioned at a first location;
• an interposer comprising a first interconnect and a second interconnect;
• and
• a first buffer die comprising a first selector and a third connector and a fourth connector, the first selector being coupled to the first connector through the first interconnect, the first selector being configured to couple the third connector to the second connector through the second interconnect based on the first signal, the third connector being positioned closer to the first location than the fourth connector.

An apparatus comprising:

• a circuit comprising a first connector and a second connector, the circuit being configured to send a first signal using the first connector to indicate a first selection, the second connector being positioned at a first location;
• an interposer coupled to the circuit, the interposer comprising a first interconnect;
• and
• a first memory device comprising a first selector and a third connector and a fourth connector, the first selector being coupled to the first connector through the first interconnect, the first selector being configured to couple the third connector to the second connector based on the first signal, the third connector being positioned closer to the first location than the fourth connector.