Semiconductor device
AssigneeLAPIS Technology Co., Ltd.
InventorTakuya MATSUMOTO
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AssigneeLAPIS Technology Co., Ltd.
InventorTakuya MATSUMOTO
Estimating the term…
A semiconductor device is formed by first and second dies manufactured by processes with different wiring widths and includes: a first switch, outputting an input power voltage when set to ON, and stopping output when set to OFF; and a second switch, outputting, from a second voltage output terminal, the power voltage output to a second voltage input terminal when set to ON and stopping output when set OFF; and at least one retention flip-flop, provided with: a first power terminal, connected with the second voltage output terminal; and a second power terminal, connected with the first voltage output terminal, and maintaining data when the power voltage is supplied to the second power terminal and supply of the power voltage to the first power terminal is cut off. The first switch is formed in a first die, and the second switch and retention flip-flop are formed in a second die.
A semiconductor device, formed by a first die manufactured by performing a first process with a large wiring width and a second die manufactured by performing a second process with a small wiring width, the semiconductor device comprising:
A semiconductor device, comprising:
A semiconductor device, configured to be connectible with a die provided with a switch that receives input of a power voltage at a voltage input terminal and outputs, from a voltage output terminal, the power voltage that is input when being in an ON state, the semiconductor device comprising:
Dependencies are inferred from the claim text.